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PDF NTMFS4927N Data sheet ( Hoja de datos )

Número de pieza NTMFS4927N
Descripción Power MOSFET ( Transistor )
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NTMFS4927N Hoja de datos, Descripción, Manual

NTMFS4927N,
NTMFS4927NC
Power MOSFET
30 V, 38 A, Single NChannel, SO8 FL
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Optimized for 5 V, 12 V Gate Drives
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
CPU Power Delivery
DCDC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
C(Nuortreen1t)RqJA
TA = 25°C
TA = 100°C
VDSS
VGS
ID
30
±20
13.6
8.6
V
V
A
Power Dissipation
RqJA (Note 1)
Continuous Drain
C(Nuortreen1t)RqJA 10 s
TA = 25°C
TA = 25°C
TA = 100°C
PD
ID
2.70 W
20.4 A
12.9
Power Dissipation
RqJA 10 s (Note 1)
Continuous Drain
C(Nuortreen2t)RqJA
Steady
State
TA = 25°C
TA = 25°C
TA = 100°C
PD
ID
6.04 W
7.9 A
5.0
Power Dissipation
RqJA (Note 2)
Continuous Drain
C(Nuortreen1t)RqJC
TA = 25°C
TC = 25°C
TC =100°C
PD
ID
0.92 W
38 A
24
Power Dissipation
RqJC (Note 1)
Pulsed Drain
Current
TC = 25°C
TA = 25°C, tp = 10 ms
PD
IDM
20.8 W
160 A
Current Limited by Package
TA = 25°C
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source DV/DT
Single Pulse DraintoSource Avalanche
Energy (TJ = 25°C, VDD = 24 V, VGS = 20 V,
IL = 20 Apk, L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
IDmax
TTSJT,G
IS
dV/dt
EAS
TL
100
55 to
+150
21
6.0
20
A
°C
A
V/ns
mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
7.3 mW @ 10 V
12.0 mW @ 4.5 V
D (5,6)
ID MAX
38 A
G (4)
S (1,2,3)
NCHANNEL MOSFET
MARKING
DIAGRAM
D
1
SO8 FLAT LEAD
CASE 488AA
STYLE 1
S
S 4927N
S AYWZZ
G
D
4927N
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
D
D
ORDERING INFORMATION
Device
Package
Shipping
NTMFS4927NT1G SO8 FL
NTMFS4927NCT1G (PbFree)
1500 /
Tape & Reel
NTMFS4927NT3G SO8 FL
NTMFS4927NCT3G (PbFree)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
June, 2012 Rev. 8
1
Publication Order Number:
NTMFS4927N/D

1 page




NTMFS4927N pdf
NTMFS4927N, NTMFS4927NC
TYPICAL CHARACTERISTICS
1200
1000
800
600
400
200
0
0
TJ = 25°C
Ciss VGS = 0 V
Coss
Crss
5 10 15 20 25
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
1000
100
VGS = 10 V
VDD = 15 V
ID = 15 A
10
td(off)
tf
tr
td(on)
1
1 10 100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
1000
100
10 ms
10 100 ms
1 0 V < VGS < 10 V
Single Pulse
TC = 25°C
0.1 RDS(on) Limit
Thermal Limit
0.01 Package Limit
0.01 0.1
1
1 ms
10 ms
dc
10 100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
11
10
QT
9
8
7
6
5
4 Qgs
Qgd
TJ = 25°C
3
2 VGS = 10 V
1
0
VDD = 15 V
ID = 30 A
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Qg, TOTAL GATE CHARGE (nC)
Figure 8. GatetoSource and
DraintoSource Voltage vs. Total Charge
30
VGS = 0 V
25
20
15
10
TJ = 125°C
TJ = 25°C
5
0
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
20
18 ID = 20 A
16
14
12
10
8
6
4
2
0
25 50
75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
http://onsemi.com
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