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PDF NTJD1155L Data sheet ( Hoja de datos )
| Número de pieza | NTJD1155L | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NTJD1155L
Power MOSFET
8 V, +1.3 A, High Side Load Switch with
Level−Shift, P−Channel SC−88
The NTJD1155L integrates a P and N−Channel MOSFET in a single
package. This device is particularly suited for portable electronic
equipment where low control signals, low battery voltages and high
load currents are needed. The P−Channel device is specifically
designed as a load switch using ON Semiconductor state−of−the−art
trench technology. The N−Channel, with an external resistor (R1),
functions as a level−shift to drive the P−Channel. The N−Channel
MOSFET has internal ESD protection and can be driven by logic
signals as low as 1.5 V. The NTJD1155L operates on supply lines from
1.8 to 8.0 V and can drive loads up to 1.3 A with 8.0 V applied to both
VIN and VON/OFF.
Features
• Extremely Low RDS(on) P−Channel Load Switch MOSFET
• Level Shift MOSFET is ESD Protected
• Low Profile, Small Footprint Package
• VIN Range 1.8 to 8.0 V
• ON/OFF Range 1.5 to 8.0 V
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Input Voltage (VDSS, P−Ch)
ON/OFF Voltage (VGS, N−Ch)
Continuous Load Current
(Note 1)
Steady
State
TA = 25°C
TA = 85°C
Power Dissipation
(Note 1)
Steady TA = 25°C
State TA = 85°C
Pulsed Load Current
tp = 10 ms
Operating Junction and Storage Temperature
VIN
VON/OFF
IL
PD
ILM
TTSJT,G
8.0
8.0
±1.3
±0.9
0.40
0.20
±3.9
−55 to
150
V
V
A
W
A
°C
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IS −0.4 A
TL 260 °C
THERMAL CHARACTERISTICS
Characteristic
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
320 °C/W
Junction−to−Foot – Steady State (Note 1)
RqJF
220
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 inch sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2012
November, 2012 − Rev. 5
1
http://onsemi.com
V(BR)DSS
8.0 V
RDS(on) TYP
130 mW @ −4.5 V
170 mW @ −2.5 V
260 mW @ −1.8 V
ID MAX
±1.3 A
SIMPLIFIED SCHEMATIC
4 2,3
Q2
6
5 Q1
1
MARKING
SC−88
DIAGRAM
(SOT−363)
1 CASE 419B
STYLE 30
TB M G
TB = Device Code
G
M = Date Code
1
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
D1/G2 G1 S2
654
1 23
S1 D2 D2
ORDERING INFORMATION
Device
Package
Shipping†
NTJD1155LT1G
SC−88 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTJD1155L/D
1 page  
NTJD1155L
PACKAGE DIMENSIONS
SC−88 (SOT−363)
CASE 419B−02
ISSUE W
D
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
654
HE −E−
123
b 6 PL
0.2 (0.008) M E M
A3
A
C
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.80 0.95 1.10 0.031 0.037 0.043
A1 0.00 0.05 0.10 0.000 0.002 0.004
A3 0.20 REF
0.008 REF
b 0.10 0.21 0.30 0.004 0.008 0.012
C 0.10 0.14 0.25 0.004 0.005 0.010
D 1.80 2.00 2.20 0.070 0.078 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 BSC
0.026 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 2.00 2.10 2.20 0.078 0.082 0.086
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
A1 L
SOLDERING FOOTPRINT*
0.50
0.0197
0.40
0.0157
0.65
0.025
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NTJD1155L/D
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