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PDF NTMFS4854NS Data sheet ( Hoja de datos )

Número de pieza NTMFS4854NS
Descripción Power MOSFET ( Transistor )
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NTMFS4854NS Hoja de datos, Descripción, Manual

NTMFS4854NS
SENSEFET® Power MOSFET
25 V, 149 A, Single NChannel, SO8 FL
Features
Accurate, Lossless Current Sensing
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
CPU Power Delivery
DCDC Converters
Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
DraintoSource Voltage
VDSS
25
GatetoSource Voltage
Continuous Drain
C(Nuortreen1t)RqJA
TA = 25°C
TA = 85°C
VGS
ID
±16
24.4
17.6
Unit
V
V
A
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
2.31 W
Continuous Drain
C(Nuortreen2t)RqJA
Power Dissipation
RqJA (Note 2)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
ID
PD
15.2 A
11
0.9 W
Continuous Drain
C(Nuortreen1t)RqJC
TC = 25°C
ID
149 A
TC = 85°C
107.5
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain
Current
TA = 25°C,
tp = 10 ms
Operating Junction and Storage
Temperature
PD
IDM
TJ, TSTG
86.2
298
55 to
+150
W
A
°C
Source Current (Body Diode)
Drain to Source DV/DT
IS
dV/dt
71 A
6 V/ns
Single Pulse DraintoSource Avalanche
Energy (TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 20 Apk, L = 1.0 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
TL
200 mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
25 V
RDS(ON) MAX
2.5 mW @ 10 V
3.9 mW @ 4.5 V
DRAIN
ID MAX
149 A
119 A
GATE
Kelvin
SENSE SOURCE
1
SO8 FLAT LEAD
CASE 506BQ
MARKING
DIAGRAM
D (Do Not Connect)
S NC
S 4854NS SENSE
S AYWZZ KELVIN
G K1
D (Do Not Connect)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping
NTMFS4854NST1G SO8 FL 1500 Tape / Reel
(PbFree)
NTMFS4854NST3G SO8 FL 5000 Tape / Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
May, 2012 Rev. 1
1
Publication Order Number:
NTMFS4854NS/D

1 page




NTMFS4854NS pdf
NTMFS4854NS
TYPICAL PERFORMANCE CURVES
6000
5000
4000
Ciss
VGS = 0 V
TJ = 25°C
12
10
QT 20
15
8 VDS
VGS
3000
2000
1000
Coss
Crss
0
0 5 10 15 20
DRAINTOSOURCE VOLTAGE (VOLTS)
Figure 6. Capacitance Variation
6 10
4 Qgs
Qgd
5
2 ID = 30 A
0 TJ = 25°C 0
25 0 10 20 30 40 50 60 70 80 90
QG, TOTAL GATE CHARGE (nC)
Figure 7. GateToSource and DrainToSource
Voltage vs. Total Charge
1000
VGS = 11.5 V
VDD = 15 V
ID = 15 A
100
td(off)
tf
tr
td(on)
100
VGS = 0 V
TJ = 25°C
10
10 1.0
1
1
1000
10
RG, GATE RESISTANCE (W)
Figure 8. Resistive Switching Time
Variation vs. Gate Resistance
100
100 10 ms
VGS = 20 V
10
SINGLE PULSE
TC = 25°C
100 ms
1 ms
1
0.1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1
10
10 ms
dc
100
VDS, DRAINTOSOURCE VOLTAGE (VOLTS)
Figure 10. Maximum Rated Forward Biased
Safe Operating Area
0.1
0.3
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
VSD, SOURCETODRAIN VOLTAGE (VOLTS)
Figure 9. Diode Forward Voltage vs. Current
ID = 250 mA
VGS = VDS
1.0
0.5
50
25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Threshold Voltage
http://onsemi.com
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