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PDF S1C8F360 Data sheet ( Hoja de datos )
| Número de pieza | S1C8F360 | |
| Descripción | CMOS 8-BIT SINGLE CHIP MICROCOMPUTER | |
| Fabricantes | Epson | |
| Logotipo |  |
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CMOS 8-BIT SINGLE CHIP MICROCOMPUTER
S1C8F360
Technical Manual
1 page  
Configuration of product number
Devices
S1 C 88104 F 0A01
00
Packing specifications
00 : Besides tape & reel
0A : TCP BL 2 directions
0B : Tape & reel BACK
0C : TCP BR 2 directions
0D : TCP BT 2 directions
0E : TCP BD 2 directions
0F : Tape & reel FRONT
0G : TCP BT 4 directions
0H : TCP BD 4 directions
0J : TCP SL 2 directions
0K : TCP SR 2 directions
0L : Tape & reel LEFT
0M: TCP ST 2 directions
0N : TCP SD 2 directions
0P : TCP ST 4 directions
0Q : TCP SD 4 directions
0R : Tape & reel RIGHT
99 : Specs not fixed
Specification
Package
D: die form; F: QFP, B: BGA
Model number
Model name
C: microcomputer, digital products
Product classification
S1: semiconductor
Development tools
S5U1 C 88348 D1 1 00
Packing specifications
00: standard packing
Version
1: Version 1
Tool type
Hx : ICE
Ex : EVA board
Px : Peripheral board
Wx: Flash ROM writer for the microcomputer
Xx : ROM writer peripheral board
Cx : C compiler package
Ax : Assembler package
Dx : Utility tool by the model
Qx : Soft simulator
Corresponding model number
88348: for S1C88348
Tool classification
C: microcomputer use
Product classification
S5U1: development tool for semiconductor products
5 Page 
CONTENTS
10.6 AC Characteristics ...........................................................................................................165
10.7 Oscillation Characteristics ..............................................................................................171
10.8 Characteristics Curves (reference value) ........................................................................172
11 PACKAGE ........................................................................................................ 179
11.1 Plastic Package ................................................................................................................179
12 PAD LAYOUT .................................................................................................. 181
12.1 Diagram of Pad Layout ...................................................................................................181
12.2 Pad Coordinates ..............................................................................................................182
APPENDIX A PROM PROGRAMMING ............................................................... 183
A.1 Outline of Writing Tools ..................................................................................................183
A.2 Serial Programming (On Board Writer) .........................................................................184
A.2.1 Serial programming environment (On Board Writer) ........................................................... 184
A.2.2 System connection for serial programming (On Board Writer) ............................................ 185
A.2.3 Serial programming procedure (On Board Writer) .............................................................. 186
A.2.4 Connection diagram for serial programming (when On Board Writer is used) ................... 190
A.2.5 On Board Writer Control Software ....................................................................................... 192
A.2.5.1 Starting up .............................................................................................................. 192
A.2.5.2 Setup ....................................................................................................................... 193
A.2.5.3 Operating method ................................................................................................... 194
A.2.6 List of commands ................................................................................................................... 201
A.2.7 List of error messages ............................................................................................................ 201
A.3 Serial Programming (Universal Writer) ..........................................................................202
A.3.1 Serial programming environment (Universal Writer) ........................................................... 202
A.3.2 System connection and setup for serial programming (Universal Writer) ............................ 203
A.3.3 Serial programming procedure (Universal Writer) ............................................................... 204
A.3.4 Connection diagram for serial programming (when Universal Writer is used) ................... 206
A.4 Parallel Programming (Universal Writer) ......................................................................207
A.4.1 Parallel programming environment (Universal Writer) ....................................................... 207
A.4.2 System connection and setup for parallel programming (Universal Writer) ........................ 208
A.4.3 Parallel programming procedure (Universal Writer) ........................................................... 209
A.5 Universal Writer Specifications .......................................................................................211
A.5.1 Outline of Universal Writer specifications ............................................................................ 211
A.5.2 Universal Writer commands .................................................................................................. 212
A.5.3 List of Universal Writer commands ....................................................................................... 217
A.5.4 Universal Writer error messages ........................................................................................... 218
A.6 Flash EEPROM Programming Notes ..............................................................................219
APPENDIX B S5U1C88000P1&S5U1C88816P2 MANUAL
(Peripheral Circuit Board for S1C8F360) ...................................... 220
B.1 Names and Functions of Each Part .................................................................................220
B.2 Installation .......................................................................................................................222
B.2.1 Installing S5U1C88816P2 to S5U1C88000P1 ...................................................................... 222
B.2.2 Installing into the ICE (S5U1C88000H5) ............................................................................. 222
B.3 Connecting to the Target System .....................................................................................223
B.4 Downloading Circuit Data to the S5U1C88000P1 .........................................................225
B.5 Precautions ......................................................................................................................226
B.5.1 Precaution for operation ....................................................................................................... 226
B.5.2 Differences from actual IC .................................................................................................... 226
B.6 Product Specifications .....................................................................................................228
B.6.1 S5U1C88000P1 specifications .............................................................................................. 228
B.6.2 S5U1C88816P2 specifications .............................................................................................. 228
S1C8F360 TECHNICAL MANUAL
EPSON
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11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet S1C8F360.PDF ] | |
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