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NCP154 PDF даташит

Спецификация NCP154 изготовлена ​​​​«ON Semiconductor» и имеет функцию, называемую «Dual Input Voltage Regulator».

Детали детали

Номер произв NCP154
Описание Dual Input Voltage Regulator
Производители ON Semiconductor
логотип ON Semiconductor логотип 

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NCP154 Даташит, Описание, Даташиты
NCP154
Dual 300 mA, Low IQ, Low
Dropout, Dual Input Voltage
Regulator
The NCP154 is 300 mA, Dual Output Linear Voltage Regulator that
offers two independent input pins and provides a very stable and
accurate voltage with ultra low noise and very high Power Supply
Rejection Ratio (PSRR) suitable for RF applications. The device
doesn’t require any additional noise bypass capacitor to achieve ultra
low noise performance. In order to optimize performance for battery
operated portable applications, the NCP154 employs the Adaptive
Ground Current Feature for low ground current consumption during
light-load conditions.
Features
Operating Input Voltage Range: 1.9 V to 5.25 V
Two Independent Input Voltage Pins
Two Independent Output Voltage (for detail please refer to Ordering
Information)
Low IQ of typ. 55 mA per Channel
High PSRR: 75 dB at 1 kHz
Very Low Dropout: 140 mV Typical at 300 mA
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in XDFN8 1.2 × 1.6 mm Package
Active Output Discharge for Fast Output Turn-Off
These are Pb-free Devices
Typical Applications
Smartphones, Tablets
Wireless Handsets, Wireless LAN, Bluetooth®, ZigBee® Interfaces
Other Battery Powered Applications
VIN1
VIN2
CIN1
1 mF
CIN2
1 mF
NCP154
IN1
OUT1
IN2
OUT2
EN1
EN2
GND
VOUT1
VOUT2
COUT2
1 mF
COUT1
1 mF
http://onsemi.com
XDFN8, 1.2x1.6
CASE 711AS
PIN CONNECTIONS
GND 1
OUT1 2
OUT2 3
GND 4
8 EN1
7 IN1
EP
6 IN2
5 EN2
XDFN8
(Top View)
MARKING DIAGRAM
XM
G
X = Specific Device Code
M = Date Code
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 17 of this data sheet.
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 2
1
Publication Order Number:
NCP154/D









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NCP154 Даташит, Описание, Даташиты
NCP154
IN1
EN1
BANDGAP
REFERENCE
ENABLE
LOGIC
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT1
GND
ACTIVE
DISCHARGE
EN1
IN2
EN2
BANDGAP
REFERENCE
ENABLE
LOGIC
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT2
GND
ACTIVE
DISCHARGE
EN2
Figure 2. Simplified Schematic Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No. Pin Name
Description
1
GND
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
2
OUT1
Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
3
OUT2
Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
4
GND
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
5 EN2 Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2 and activates the active
discharge.
6 IN2 Inputs pin for second channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
7 IN1 Inputs pin for first channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
8 EN1 Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1 and activates the active
discharge.
− EP Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.
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NCP154 Даташит, Описание, Даташиты
NCP154
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
VIN1, VIN2
−0.3 V to 6 V
V
Output Voltage
VOUT1, VOUT2
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Inputs
VEN1, VEN2
−0.3 V to VIN + 0.3 V or 6 V
V
Output Short Circuit Duration
tSC Indefinite
s
Maximum Junction Temperature
TJ(MAX)
150
°C
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2,000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS (Note 3)
Rating
Thermal Characteristics, XDFN8 1.2 × 1.6 mm,
Thermal Resistance, Junction-to-Air
3. Single component mounted on 1 oz, FR4 PCB with 645 mm2 Cu area.
Symbol
qJA
Value
160
Unit
°C/W
http://onsemi.com
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