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Número de pieza | NTSS5100 | |
Descripción | Low Leakage Trench-based Schottky Rectifier | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de NTSS5100 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! NTSS5100, NTSAF5100
Low Forward Voltage, Low
Leakage Trench-based
Schottky Rectifier
Features
• Fine Lithography Trench−based Schottky Technology for Very Low
Forward Voltage and Low Leakage
• Fast Switching with Exceptional Temperature Stability
• Low Power Loss and Lower Operating Temperature
• Higher Efficiency for Achieving Regulatory Compliance
• High Surge Capability
• These are Pb−Free and Halide−Free Devices
Typical Applications
• Switching Power Supplies including Wireless, Smartphone and
Notebook Adapters
• High Frequency and DC−DC Converters
• Freewheeling and OR−ing diodes
• Reverse Battery Protection
• Instrumentation
• LED Lighting
Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
www.onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
5 AMPERES
100 VOLTS
MARKING
DIAGRAM
SMB
CASE 403A
AYWW
TH51G
G
SMA−FL
CASE 403AA
STYLE 6
AYWW
H51G
G
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTSS5100T3G
Package
SMB
(Pb−Free)
Shipping†
5000 /
Tape & Reel
NTSAF5100T3G
SMA−FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 1
1
Publication Order Number:
NTSS5100/D
1 page HE
E
bD
POLARITY INDICATOR
OPTIONAL AS NEEDED
L L1 c
NTSS5100, NTSAF5100
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS
DIM MIN
NOM MAX
A 1.95
2.30
2.47
A1 0.05
0.10
0.20
b 1.96 2.03 2.20
c 0.15 0.23 0.31
D 3.30
3.56
3.95
E 4.06
4.32
4.60
H E 5.21 5.44 5.60
L 0.76 1.02 1.60
L1 0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
ǒ ǓSCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet NTSS5100.PDF ] |
Número de pieza | Descripción | Fabricantes |
NTSS5100 | Low Leakage Trench-based Schottky Rectifier | ON Semiconductor |
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