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PDF NDBA170N06A Data sheet ( Hoja de datos )
| Número de pieza | NDBA170N06A | |
| Descripción | N-Channel Power MOSFET / Transistor | |
| Fabricantes | ON Semiconductor | |
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Ordering number : ENA2250
NDBA170N06A
N-Channel Power MOSFET
60V, 170A, 3.3mΩ, TO-263
Features
• On-resistance RDS(on)=2.5mΩ(typ.)
• Input Capacitance Ciss=15800pF(typ.)
• Halogen free compliance
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Drain to Source Voltage
VDSS
Gate to Source Voltage
Drain Current (DC)
Drain Current (DC) Limited by Package
Drain Current (Pulse)
PW≤10μs, duty cycle≤1%
Power Dissipation
Tc=25°C
VGSS
ID
IDL
IDP
PD
Junction Temperature
Tj
Storage Temperature
Tstg
Avalanche Energy (Single Pulse) *1
Avalanche Current *2
Lead Temperature for Soldering
Purposes, 3mm from Case for 10 Seconds
EAS
IAV
TL
Value
60
±20
170
100
600
90
150
- 55 to
+150
571
70
260
Unit
V
V
A
A
A
W
°C
°C
mJ
A
°C
Thermal Resistance Ratings
Parameter
Junction- to-Case(Drain) Steady State
Junction-to-Ambient *3
Symbol
RθJC
RθJA
Value
1.39
62.5
Unit
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Note : *1 VDD=36V, L=100μH, IAV=70A (Fig.1)
*2 L≤100μH, Single Pulse
*3 Surface mounted on FR4 board using recommended footprint
http://onsemi.com
Electrical Connection
N-channel
D(2, 4)
G(1)
S(3)
4
12
3
TO-263
CASE 418AJ
Marking
170N06
A LOT No.
Packing Type:TL
TL
Ordering & Package Information
Device
NDBA170N06AT4H
Pb-free and
Halogen Free
Package
TO-263
Shipping
800
pcs. / reel
Semiconductor Components Industries, LLC, 2013
December, 2013
D1113 TKIM TC-00003075 No. A2250-1/6
1 page  
NDBA170N06A
PACKAGE DIMENSIONS
D2PAK-3 (TO-263, 3-LEAD)
CASE 418AJ
ISSUE B
SCALE 1:1
E
E2
L1
H
e
NOTE 6
TOP VIEW
AA
NOTE 3
D
B
SEATING
PLANE
c2
A
DETAIL C
D1
L2
c
2X b SIDE VIEW
0.10 M B A M
A
M
L1
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
VIEW A-A
GAUGE
PLANE
L3
0.10 M B A M
H
L A1
DETAIL C
B
SEATING
PLANE
INCHES
DIM MIN MAX
A 0.160 0.190
A1 0.000 0.010
b 0.020 0.039
c 0.012 0.029
c2 0.045 0.065
D 0.330 0.380
D1 0.260 -----
E 0.380 0.420
E1 0.245 -----
e 0.100 BSC
H 0.575 0.625
L 0.070 0.110
L1 ----- 0.066
L2 ----- 0.070
L3 0.010 BSC
M 0º
8º
MILLIMETERS
MIN MAX
4.06 4.83
0.00 0.25
0.51 0.99
0.30 0.74
1.14 1.65
8.38 9.65
6.60 -----
9.65 10.67
6.22 -----
2.54 BSC
14.60 15.88
1.78 2.79
----- 1.68
----- 1.78
0.25 BSC
0º 8º
VIEW A-A
OPTIONAL CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
GENERIC MARKING DIAGRAMS*
XX
XXXXXXXXX
AWLYWWG
XXXXXXXXG
AYWW
AYWW
XXXXXXXXG
AKA
XXXXXX
XXYMW
0.653
0.366
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
W = Week Code (SSG)
M = Month Code (SSG)
G = Pb-Free Package
AKA = Polarity Indicator
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb −Free indicator, “G” or microdot “ ”,
may or may not be present.
No.A2250-5/6
5 Page | ||
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| PDF Descargar | [ Datasheet NDBA170N06A.PDF ] | |
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