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PDF CBT16212 Data sheet ( Hoja de datos )
| Número de pieza | CBT16212 | |
| Descripción | 24-bit bus exchange switch | |
| Fabricantes | NXP Semiconductors | |
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CBT16212
24-bit bus exchange switch with 12-bit output enables
Rev. 02 — 3 November 2008
Product data sheet
1. General description
The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or
exchanging. The low ON resistance of the switch allows connections to be made with
minimal propagation delay.
The CBT16212 operates either as a 24-bit bus switch or as a 12-bit bus exchanger,
providing data exchange between four signal ports using the port select inputs (S0, S1
and S2).
The CBT16212 is characterized for operation from –40 °C to +85 °C.
2. Features
I 5 Ω switch connection between two ports
I TTL compatible input levels
I ESD protection:
N HBM JESD22-A114E Class 1C exceeds 1500 V
N CDM JESD22-C101C exceeds 1000 V
I Latch-up performance:
N JESD78 exceeds 100 mA
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range Name
Description
CBT16212DGG −40 °C to 85 °C
TSSOP56 plastic thin shrink small outline package; 56 leads;
body width 6.1 mm
CBT16212DL
−40 °C to 85 °C
SSOP56 plastic shrink small outline package; 56 leads; body
width 7.5 mm
Version
SOT364-1
SOT371-1
1 page  
NXP Semiconductors
CBT16212
24-bit bus exchange switch with 12-bit output enables
9. Static characteristics
Table 6. Static characteristics
Tamb = −40 °C to +85 °C.
Symbol Parameter
Conditions
VIK
II
ICC
∆ICC
input clamping voltage
input leakage current
supply current
additional supply current
VCC = 4.5 V; II = −18 mA
VCC = 0 V; VI = 5.5 V
VCC = 5.5 V; VI = VCC or GND
VCC = 5.5 V; IO = 0 A;
VI = VCC or GND
per port select input pin; VCC = 5.5 V;
one input at 3.4 V, other inputs at VCC
or GND
[2]
CI
Cio(off)
RON
input capacitance
port select input pins; VI = 3 V or 0 V;
VCC = 5.0 V;
off-state input/output capacitance VO = 3 V or 0 V; VCC = 0 V
ON resistance
VCC = 4.0 V
VI = 2.4 V; II = 15 mA
VCC = 4.5 V
VI = 0 V; II = 64 mA
VI = 0 V; II = 30 mA
VI = 2.4 V; II = 15 mA
[3]
[3]
Min
-
-
-
-
-
-
-
-
-
-
-
Typ[1]
-
-
-
-
-
4.7
11.5
-
4
4
6
Max Unit
−1.2 V
10 µA
±1 µA
3 µA
2.5 mA
- pF
- pF
21 Ω
7Ω
7Ω
12 Ω
[1] All typical values are measured at Tamb = 25 °C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
Table 7. Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; for test circuit see Figure 6.
Symbol Parameter
Conditions
tpd propagation delay
ten enable time
tdis disable time
input A or B to output B or A; see Figure 4
port select input to output A or B; Figure 5
port select input to output A or B; Figure 5
Min
[1][2]
-
[3] 2.4
[4] 2.4
Max Unit
0.25 ns
8.0 ns
8.0 ns
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical
ON resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).
[2] tpd is the same as tPLH and tPHL.
[3] ten is the same as tPZL and tPZH.
[4] tdis is the same as tPLZ and tPHZ.
CBT16212_2
Product data sheet
Rev. 02 — 3 November 2008
© NXP B.V. 2008. All rights reserved.
5 of 12
5 Page 
NXP Semiconductors
CBT16212
24-bit bus exchange switch with 12-bit output enables
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
CBT16212_2
Product data sheet
Rev. 02 — 3 November 2008
© NXP B.V. 2008. All rights reserved.
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