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PDF HCM1012GH900A05P Data sheet ( Hoja de datos )

Número de pieza HCM1012GH900A05P
Descripción Chip Common Mode Filter
Fabricantes UN Semiconducctor 
Logotipo UN Semiconducctor Logotipo



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No Preview Available ! HCM1012GH900A05P Hoja de datos, Descripción, Manual

LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
Features and Application
Powerful components with composite co-fired material to
solve EMI problem for high speed differential signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
MIPI, MHL serial interface in mobile device.
PRODUCT DETAIL
Part Number
HCM1012GH900A05P
Imp.Com.
(Ω)±25%
@100MHz
90
DCR
Max.
(Ω)
1.0
Rated
Current
Max.(m A)
100
Rated
Voltage
(V)
10
HCM1012GD900A05P
90
1.5
100
10
HCM1012GD670A05P
67
1.5
100
10
HCM1012GD900B05P
90
3.0
100
10
Test Instruments
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
HP4338 MILLIOHMMETER
Agilent E5071C ENA SERIES NETWORK ANALYZER
Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
HCM 1012 G 90 0 05 P
1 2 345 67 8 9
1: Series name
2: Dimensions L*W
3: Material code
4: Product identification number
5: Impedance value
6: Fixed decimal point (ex : 900=90Ω)
7: UN internal code
8: Dimension T (ex : 05=0.50mm)
9: Packaging style P Embossed paper tape, 7reel.
Insulation
Resistance
Min.(MΩ)
100
100
100
100
UN Semiconductor Co., Ltd.
Revision December 18, 2014
1/6
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.

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HCM1012GH900A05P pdf
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
REEL DIMENSIONS
STANDARD QUANTITY FOR PACKAGING
Packaging style : Taping
Reel packaging quantity : 4000 pcs/reel
Inner box : 5 reel/inner box
RECOMMENDED SOLDERING CONDITIONS
GENERAL TECHNICAL DATA
Opertation temperatur range : -40~ +85
Storage Condition : Less than 40and 70% RH
Storage Time: 6 months Max.
Soldering method: Reflow or Wave Soldering
UN Semiconductor Co., Ltd.
Revision December 18, 2014
5/6
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.

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