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Datasheet M14C32 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 3 | M14C32 | Memory Micromodules General Information for D1/ D2 and C Packaging D10, D15, D20, D22, C20, C30 MICROMODULES
Memory Micromodules General Information for D1, D2 and C Packaging
s
Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding inte |
 STMicroelectronics |
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| 2 | M14C32 | Memory Card IC 64/32 Kbit Serial IC Bus EEPROM D10, D15, D20, D22, C20, C30 MICROMODULES
Memory Micromodules General Information for D1, D2 and C Packaging
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Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding inte |
STMicroelectronics |
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| 1 | M14C32DD | M14C32 Die Description M14C32 DD
M14C32 Die Description
PRODUCT s WAFER SIZE
s s s s
M14C32 152 mm (6 inches) 2040 x 2355 µm 100.5 x 101.7 µm 100 x 100 µm
DIE IDENTIFICATION M14C32KA_R DIE SIZE (X x Y) SCRIBE LINE PAD OPENING
s s s s
DIE LAYOUT DI C1, C2, C3, C5, C7 C4, C6, C8 NC
Die Identification (at the positi |
STMicroelectronics |
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