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PDF SKHI22AR Data sheet ( Hoja de datos )

Número de pieza SKHI22AR
Descripción Hybrid Dual MOSFET Driver
Fabricantes Semikron International 
Logotipo Semikron International Logotipo



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No Preview Available ! SKHI22AR Hoja de datos, Descripción, Manual

SKHI 21A (R) ...
SEMIDRIVERTM
Hybrid Dual MOSFET
Driver
SKHI 21A (R)
Features
   
    
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This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
1
30-09-2008 MHW
© by SEMIKRON

1 page




SKHI22AR pdf
PIN array
Fig. 2 shows the pin arrays. The input side (primary side) comprises 10 inputs (SKHI 22A / 21A 8 inputs), forming the
interface to the control circuit (see fig.1).
The output side (secondary side) of the hybrid driver shows two symmetrical groups of pins with 4 outputs, each forming
the interface to the power module. All pins are designed for a grid of 2,54 mm.
Primary side PIN array
PIN No. Designation
P14 GND / 0V
P13
P12
VS
VIN1
P11 free
P10 /ERROR
P9 TDT2
P8 VIN2
P7 GND / 0V
P6 SELECT
P5 TDT1
Explanation
related earth connection for input signals
+ 15V ± 4% voltage supply
switching signal input 1 (TOP switch)
positive 5V logic (for SKHI22A /21A, 15V logic)
not wired
error output, low = error; open collector output; max 30V / 15mA
(for SKHI22A /21A, internal 10kΩ pull-up resistor versus VS)
signal input for digital adjustment of interlocking time;
SKHI22B: to be switched by bridge to GND (see fig. 3)
SKHI22A /21A: to be switched by bridge to VS
switching signal input 2 (BOTTOM switch);
positive 5V logic (for SKHI22A /21A, 15V logic)
related earth connection for input signals
signal input for neutralizing locking function;
to be switched by bridge to GND
signal input for digital adjustment of locking time;
to be switched by bridge to GND
ATTENTION: Inputs P6 and P5 are not existing for SKHI 22A/ 21A. The contactor tracks of the digital input signals P5/
P6/ P9 must not be longer than 20 mm to avoid interferences, if no bridges are connected.
Secondary side PIN array
PIN No.
S20
S15
S14
S13
S12
S1
S6
S7
S8
S9
Designation
VCE1
CCE1
GON1
GOFF1
E1
VCE2
CCE2
GON2
GOFF2
E2
Explanation
collector output IGBT 1 (TOP switch)
reference voltage adjustment with RCE and CCE
gate 1 RON output
gate 1 ROFF output
emitter output IGBT 1 (TOP switch)
collector output IGBT 2 (BOTTOM switch)
reference voltage adjustment with RCE and CCE
gate 2 RON output
gate 2 ROFF output
emitter output IGBT 2 (BOTTOM switch)
ATTENTION: The connector leads to the power module should be as short as possible.
3 Driver Electronic – PCB Drivers
30-09-2008 © by SEMIKRON

5 Page





SKHI22AR arduino
Persons working with CMOS-devices have to wear a
grounded bracelet. Any synthetic floor coverings must not
be statically chargeable. Even during transportation the
input terminals have to be short-circuited using, for
example, conductive rubber. Worktables have to be
grounded. The same safety requirements apply to
MOSFET- and IGBT-modules!
The connecting leads between hybrid driver and the
power module should be as short as possible, the driver
leads should be twisted.
Any parasitic inductances within the DC-link have to be
minimized. Over-voltages may be absorbed by C- or
RCD-snubbers between the main terminals for PLUS and
MINUS of the power module.
When first operating a newly developed circuit,
SEMIKRON recommends to apply low collector voltage
and load current in the beginning and to increase these
values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes
generated accross the IGBT. An oscillographic control will
be necessary. In addition to that the case temperature of
the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit
testing may be done, starting again with low collector
voltage.
It is important to feed any errors back to the control circuit
and to switch off the device immediately in such events.
Repeated turn-on of the IGBT into a short circuit with a
high frequency may destroy the device.
Mechanical fixing on PCB:
In applications with mechanical vibrations do not use a
ty-rap for fixing the driver, but - after soldering and testing
- apply special glue. Recommended types: CIBA GEIGY
XP 5090 + 5091; PACTAN 5011; WACKER A33 (ivory) or
N199 (transparent), applied around the case edge (forms
a concave mould). The housing may not be pressed on the
PCB; do not twist the PCB with the driver soldered on,
otherwise the internal ceramics may crack. The driver is
not suitable for big PCBs.
Proven, within the scope of the product qualification, was
the use of the driver with the printed circuit board
SKPC 2006 ( L x B x H = 97,0 x 67,5 x 1,5 mm). During the
test, the driver was stuck with glue on the printed circuit
board. Based on this information the technical conclusion
arises, that in an application with big printed circuit boards,
this board must be supported and reinforced in the area of
the driver.
If a PCB is directly plugged to IGBT modules, the PCB has
to be fixed to the heat sink by thread bolts.
The temperature of the solder must not exceed 265°C,
and solder time must not exceed 4 seconds. The ambient
temperature must not exceed the specified maximum
storage temperature of the driver.
The driver is not suited for hot air reflow or infrared reflow
soldering processes.
Storage hints
- Store driver only in original packaging.
- Avoid contamination of driver's surface during storage,
handling and processing.
- Please use the driver within one year after driver
manufacturing date. The manufacturing date is marked on
the driver. Usage of the driver beyond this shelf life could
compromise product long term reliability.
- Further storage conditions are indicated in the data
sheet
Environmental conditions
The driver is type tested under the environmental
conditions below.
Thermal cycling test:
- 100 cycle -40°C … +85°C
Vibration test according DIN IEC 68-2-6:
- Sinusoidal sweep: 10 Hz … 100 Hz
-1 Octave / min.
-Acceleration: 1,5 g
-Axes: 3 (x, y, z)
-26 sweeps per axis
-Driver soldered on board SKPC 2006 (L x B x H = 97,0
x 67,5 x 1,5mm)
-Driver stuck with glue on printed circuit board (see
application notes)
Shock test according DIN IEC 68-2-27:
- Half-sinusoidal pulse
-Peak acceleration: 5 g
-Shock width: 18ms
-3 shocks in each direction (±x, ±y und ±z)
-18 shocks in total
-Driver soldered on board SKPC 2006 (L x B x H = 97,0
x 67,5 x 1,5mm)
-Driver stuck with glue on printed circuit board (see
application notes)
9 Driver Electronic – PCB Drivers
30-09-2008 © by SEMIKRON

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