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Número de pieza | CPC1708 | |
Descripción | DC-Only Power Relay | |
Fabricantes | IXYS | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CPC1708 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, JC
Rating
60
11.85
4
0.08
0.35
Units
VP
ADC
°C/W
Features
• 11.85ADC Load Current with 5°C/W Heat Sink
• Low 0.08 On-Resistance
• 60VP Blocking Voltage
• 2500Vrms Input/Output Isolation
• Low Thermal Resistance: JC = 0.35 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
Pin Configuration
12
+-
34
-+
CPC1708
60V Single-Pole, Normally Open
DC-Only Power Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of High Power Solid
State Relays. As part of this new family, the CPC1708
single-pole normally open (1-Form-A) DC Solid State
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The relay output is constructed with efficient MOSFET
switches that use IXYS Integrated Circuits Division's
patented OptoMOS architecture. The input, a highly
efficient infrared LED, controls the optically coupled
output. Low on-resistance and high load current
handling capability make this relay suitable for a
variety of high performance DC switching applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low junction-to-case thermal resistance
(0.35°C/W).
Ordering Information
Part
CPC1708J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
IF
ILOAD
90%
ton
10%
toff
DS-CPC1708 - R07
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1
1 page INTEGRATED CIRCUITS DIVISION
CPC1708
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=1ADC)
-20 0 20 40 60 80
Temperature (ºC)
100
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
25
1ºC/W
20
15
5ºC/W
10
10ºC/W
5
Free Air
0
0 20
40 60
Temperature (ºC)
80
100
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=max rated)
-20 0 20 40 60 80
Temperature (ºC)
100
Blocking Voltage vs. Temperature
185
180
175
170
165
160
155
150
145
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Typical Load Current vs. Load Voltage
(IF=10mA)
5.0
4.0
3.0
2.0
1.0
0.0
0
0.05 0.10 0.15 0.20 0.25 0.30
Load Voltage (V)
Typical Leakage vs. Temperature
At Maximum Rated Voltage
Measured Across Pins 1 & 2
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Energy Rating Curve
Free Air, No Heat Sink
35
30
25
20
15
10
5
0
10µs 100µs 1ms 10ms 100ms 1s
Time
10s 100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
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R07
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet CPC1708.PDF ] |
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