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PDF CMH08 Data sheet ( Hoja de datos )
| Número de pieza | CMH08 | |
| Descripción | High Efficiency Rectifier | |
| Fabricantes | Toshiba Semiconductor | |
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TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH08
CMH08
Switching Mode Power Supply Applications
• Repetitive peak reverse voltage: VRRM = 400 V
• Average forward current: IF (AV) = 2.0 A
• Low forward voltage: VFM=1.3 V(Max.)
• Very fast reverse recovery time: trr =50ns(Max.)
• Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
Peak one cycle surge forward current
(non-repetitive)
VRRM
IF (AV)
IFSM
400
2.0 (Note 1)
30 (50 Hz)
V
A
A
Junction temperature
Storage temperature range
Tj
−40~150
°C
Tstg
−40~150
°C
Note 1:
Note 2:
Tℓ＝110°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness:0.64t
JEDEC
JEITA
―
―
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
TOSHIBA
3-4E1A
temperature, etc.) may cause this product to decrease in the
Weight: 0.023 g (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Peak repetitive reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Symbol
VFM (1)
VFM (2)
VFM (3)
IRRM
trr
tfr
Rth (j-a)
Rth (j-ℓ)
Test Condition
IFM = 0.1 A (pulse test)
IFM = 1.0 A (pulse test)
IFM = 2.0 A (pulse test)
VRRM = 400 V (pulse test)
IF = 1 A, di/dt = −30 A/μs
IF = 1.0 A
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
Min Typ. Max Unit
⎯ 0.77 ⎯
⎯ 0.98 ⎯
V
⎯ 1.1 1.3
⎯ ⎯ 10 μA
⎯ ⎯ 50 ns
⎯ ⎯ 100 ns
⎯ ⎯ 60
⎯ ⎯ 135 °C/W
⎯ ⎯ 210
⎯ ⎯ 16 °C/W
1 2006-11-08
1 page  
CMH08
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
20070701-EN
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5 2006-11-08
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CMH08.PDF ] | |
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