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PDF APTM100H18FG Data sheet ( Hoja de datos )

Número de pieza APTM100H18FG
Descripción MOSFET Power Module
Fabricantes Microsemi 
Logotipo Microsemi Logotipo



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No Preview Available ! APTM100H18FG Hoja de datos, Descripción, Manual

APTM100H18FG
Full - Bridge
MOSFET Power Module
VDSS = 1000V
RDSon = 180mtyp @ Tj = 25°C
ID = 43A @ Tc = 25°C
Q1
G1
S1
Q2
G2
S2
G1 VBUS
S1
S3
G3
VB US
Q3
Q4
0/VBUS
O UT 1
0/VBUS
O UT 2
Application
Welding converters
Switched Mode Power Supplies
G3 Uninterruptible Power Supplies
Motor control
S3 Features
Power MOS 7® FREDFETs
G4 - Low RDSon
- Low input and Miller capacitance
- Low gate charge
S4 - Fast intrinsic reverse diode
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
G2
S2 Benefits
S4 Outstanding performance at high frequency operation
G4 Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Absolute maximum ratings
Symbol
Parameter
VDSS Drain - Source Breakdown Voltage
ID Continuous Drain Current
IDM
VGS
RDSon
PD
IAR
EAR
EAS
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
Tc = 25°C
Tc = 80°C
Tc = 25°C
Max ratings
1000
43
33
172
±30
210
780
25
50
3000
Unit
V
A
V
m
W
A
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–6

1 page




APTM100H18FG pdf
Breakdown Voltage vs Temperature
1.15
1.10
1.05
1.00
0.95
0.90
0.85
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
Threshold Voltage vs Temperature
1.2
1.1
1.0
0.9
0.8
0.7
0.6
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
Capacitance vs Drain to Source Voltage
100000
10000
Ciss
1000
Coss
Crss
100
0 10 20 30 40 50
VDS, Drain to Source Voltage (V)
APTM100H18FG
ON resistance vs Temperature
2.5
VGS=10V
2.0 ID=21.5A
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
1000
Maximum Safe Operating Area
100 limited by RDSon
100µs
1ms
10
1
1
Single pulse
TJ=150°C
TC=25°C
10ms
10 100 1000
VDS, Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
14
12
ID=43A
TJ=25°C
10
VDS=200V
VDS=500V
8 VDS=800V
6
4
2
0
0 100 200 300 400 500
Gate Charge (nC)
www.microsemi.com
5–6

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