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PDF HSDL-3602-007 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-3602-007 | |
| Descripción | Agilent HSDL-3602 IrDA Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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Agilent HSDL-3602
IrDA® Data 1.4 Compliant
4 Mb/s 3V Infrared Transceiver
Data Sheet
Description
The HSDL-3602 is a low-height
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data link.
The module is compliant to IrDA
Data Physical Layer Specifica-
tions 1.1 and IEC825-Class 1 Eye
Safety Standard.
VCC
R1
LEDA (10)
TXD (9)
SP
MD0 (4)
MD1 (5)
HSDL-3602
RXD (8)
FIR_SEL (3)
GND (7)
CX1
CX2
VCC (1)
AGND (2)
HSDL-3602 Functional block diagram
Applications
• Digital imaging
— Digital still cameras
— Photo-imaging printers
• Data communication
— Notebook computers
— Desktop PCs
— Win CE handheld products
— Personal Digital Assistants
(PDAs)
— Printers
— Fax machines, photocopiers
— Screen projectors
— Auto PCs
— Dongles
— Set-top box
• Telecommunication products
— Cellular phones
— Pagers
• Small industrial and medical
instrumentation
— General data collection
devices
— Patient and pharmaceutical
data collection devices
• IR LANs
Features
• Fully compliant to IrDA
1.1 specifications:
— 9.6 kb/s to 4 Mb/s operation
— Excellent nose-to-nose
operation
• Typical link distance > 1.5 m
• IEC825-Class 1 eye safe
• Wide operating voltage range
— 2.7 V to 3.6 V
• Small module size
— 4.0 x 12.2 x 4.9 mm (H x W x D)
• Complete shutdown
— TXD, RXD, PIN diode
• Low shutdown current
— 10 nA typical
• Adjustable optical power
management
— Adjustable LED drive-current
to maintain link integrity
• Single Rx data output
— FIR select pin switch to FIR
• Integrated EMI shield
— Excellent noise immunity
• Edge detection input
— Prevents the LED from long
turn-on time
• Interface to various super I/O and
controller devices
• Designed to accommodate light
loss with cosmetic window
• Only 2 external components are
required
1 page  
Recommended Operating Conditions
Parameter
Symbol
Operating Temperature
TA
Supply Voltage
Logic High Input Voltage
for TXD, MD0, MD1, and
FIR_SEL
VCC
VIH
Logic Low Transmitter
Input Voltage
VIL
LED (Logic High) Current
Pulse Amplitude
ILEDA
Receiver Signal Rate
Minimum
–20
2.7
2 VCC/3
0
400
0.0024
Maximum
+70
3.6
VCC
VCC/3
650
4
Unit Conditions
˚C
V
V
V
mA
Mb/s
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions
can be anywhere in their operating range. All typical values are at 25˚C and 3.3 V unless otherwise noted.
Parameter
Symbol Min. Typ. Max. Units Conditions
Transceiver
Supply Current
Digital Input
Current
Shutdown
Idle
Logic
Low/High
ICC1
ICC2
IL/IH
10
2.5
–1
200 nA
5 mA
1 µA
VSD ≥ VCC – 0.5
VI(TXD) ≤ VIL, EI = 0
0 ≤ VI ≤ VCC
Transmitter
Transmitter
Radiant
Intensity
Logic High
Intensity
Peak
Wavelength
EIH
λp
100 250
875
400 mW/sr VIH = 3.0 V
ILEDA = 400 mA
θ1/2 ≤ 15˚
nm
Spectral Line ∆λ1/2 35 nm
Half Width
Viewing Angle
Optical
Pulse Width
2θ1/2
tpw (EI)
30
1.5
1.6
60 ˚
1.8 µs
tpw(TXD) = 1.6 µs at 115.2 kb/s
148 217
260 ns
tpw(TXD) = 217 ns at 1.15 Mb/s
115 125
135 ns
tpw(TXD) = 125 ns at 4.0 Mb/s
Rise and
Fall Times
Maximum
Optical
Pulse Width
tr (EI),
tf (EI)
tpw (max)
40 ns
20 50 µs
tpw(TXD) = 125 ns at 4.0 Mb/s
tr/f(TXD) = 10 ns
TXD pin stuck high
LED Anode On State Voltage
LED Anode Off State Leakage
Current
VON(LEDA)
ILK(LEDA)
2.4 V
ILEDA = 400 mA, VI(TXD) ≥ VIH
1
100 nA
VLEDA = VCC = 3.6 V,
VI(TXD) ≤ VIL
5
5 Page 
Reflow Profile
The reflow profile is a straight-
line representation of a nominal
temperature profile for a convec-
tive reflow solder process. The
temperature profile is divided
into four process zones, each
with different ∆T/∆time tempera-
ture change rates. The ∆T/∆time
rates are detailed in the following
table. The temperatures are mea-
sured at the component to
printed circuit board connections.
In process zone P1, the PC
board and HSDL-3602
castellation I/O pins are heated
to a temperature of 125°C to
activate the flux in the solder
paste. The temperature ramp up
rate, R1, is limited to 4°C per
second to allow for even heating
of both the PC board and
HSDL-3602 castellation I/O pins.
Process zone P2 should be of
sufficient time duration (> 60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170°C
(338°F).
230
200
183
170
150
125
100 R1
R2
MAX. 245°C
R3 R4
90 sec.
MAX.
ABOVE
183°C
R5
50
25
0
P1
HEAT
UP
50 100 150 200
t-TIME (SECONDS)
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
250
P4
COOL
DOWN
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
∆T
25˚C to 125˚C
125˚C to 170˚C
170˚C to 230˚C
(245˚C at 10 seconds max.)
230˚C to 170˚C
170˚C to 25˚C
300
Maximum
∆T/∆time
4˚C/s
0.5˚C/s
4˚C/s
–4˚C/s
–3˚C/s
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230°C (446°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder connec-
tions becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170°C (338°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25°C (77°F) should not exceed
-3°C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3602
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the
HSDL-3602 transceiver.
11
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet HSDL-3602-007.PDF ] | |
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