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PDF HSDL-2100 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-2100 | |
| Descripción | Infrared IrDA Compliant Transceiver | |
| Fabricantes | HP | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HSDL-2100 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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wwICTwneo.DfcmrhaantparileSciadhalenIDtraDTtAaransceiver HSDL-2100
omFeatures
.c• Small Module Package
– height of 5.5 mm max.
U• Integrated EMI Shield
– excellent Noise Immunity
t4• Lower ILEDA Current
• IEC825-Class 1 Eye Safe
e• Enhanced Reliability
ePerformance
• Fully Compliant to IrDA 1.1
hSpecifications
– excellent Nose-to-Nose
Soperation
– 2 Channels:
ta– 2.4 Kb/s to 115.2 Kb/s
– 576 Kb/s to 4.0 Mb/s
a• Designed to Accommodate
Light Loss with Cosmetic
.DWindows
• Compatible with ASK,
HP-SIR and TV Remote
w• No Mode Programming
Required
w• Interfaces to Various Super
mI/O and Controller Devices
w .coApplications
U• Data Communication:
t4Notebook Computers,
eSubnotebook Computers,
eDesktop Computers,
hPrinters, PDAs, Fax/
taSPhotocopier
a• Digital Imaging:
Digital Cameras, Photo
www.DImaging Printers
• Digital Appliances:
Internet Web TVs,
Internet Appliances
• Industrials and Medical
Instrumentation
– General Data Collection
Devices
– Patient and Pharmaceutical
Data Collection
• IR LANs
Description
The HSDL-2100 is a new
generation low-cost Infrared (IR)
transceiver module that provides
the interface between logic and
IR signals for through-air, serial,
half-duplex IR data links and is
compliant to IrDA Physical Layer
Specification 1.1. This module
is also IEC825-Class 1 Eye Safe.
Package
This IR module provides two
output signals, RXD-A for signal
rates from 2.4 Kb/s to 115.2 Kb/s
and RXD-B for signal rates of
0.576 Mb/s to 4.0 Mb/s.
HSDL-2100 consists of the
following basic elements: an
Optical SubAssembly (OSA) and
an Electrical SubAssembly (ESA)
combination with an integrated
EMI shield.
I/O pins configuration table is
shown on page 2. HSDL-2100
block diagram and recommended
application circuit is illustrated in
Figure 1 on page 3. The IR
transceiver module package
outline and recommended
PCBoard Pad layout, (Option
#001 — Integrated EMI shield
with guide pins) is illustrated
in Figure 2 on page 4.
Benefits
This combination of an integrated
EMI shield and transceiver sub-
assembly utilizes existing in-
house high-volume assembly
processes ensuring high quality
and high-volume supply. An
integrated EMI shield helps to
ensure low EMI emissions and
high immunity to EMI fields,
enhancing reliable performance.
1 page  
5
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #002 — Integrated EMI shield without Guide Pins.)
1.05
1.00
7.5 ± 0.20
8.8 ± 0.20
13.00 ± 0.20
TYP. R 0.15
11
TYP. 0.55
1.143 BSC
2.80 ± 0.30
5.30 ± 0.20
10
3.20 ± 0.30
0.80 ± 0.15
5.50
± 0.15
9.60 ± 0.30
1.00+
0.15
0
0.51 ± 0.15
0.97 ± 0.10
(10X) 0.70
PIN
1
3° ± 3°
1.50 ± 0.30
0.80 ± 0.20
SHIELD GROUND PIN
1.05 ± 0.10
1.31 ± 0.10
2.31 ± 0.10
1.143
BSC
5.05
(10X) 2.60
2.92
2.40 A
SHIELD SOLDER PAD
1.25
NOTES:
1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK.
2. LETTER 'A' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
Figure 3.
5 Page 
11
Tape and Reel Dimensions
1.75 ± 0.10
16.00 ± 0.10
4.00 ± 0.10
1.50 ±0.10
2.00 ± 0.10
11.50 ± 0.10
24.00 ± 0.20
4.88 ± 0.10
LENS FACING DIRECTION
4° MAX.
8° MAX.
8.56 ± 0.10
7.05 ± 0.10
13.16 ± 0.10
Figure 5.
Reel for 24 mm Tape
REEL FOR 24 mm TAPE
30.4 MAX.
MEASURED
AT HUB
24.4
+
2.00
0
MEASURED
AT HUB
1.5 MIN.
20.2 MIN.
330 MAX.
100.0
±
0.50
HUB DIAMETER
(SCROLL START)
1.30 ± 0.20
Figure 6.
DIMENSIONS IN MILLIMETERS
27.40 MEASURED AT
23.90 OUTER EDGE
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet HSDL-2100.PDF ] | |
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