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PDF CX77301 Data sheet ( Hoja de datos )

Número de pieza CX77301
Descripción PA Module for Dual-Band EGSM900
Fabricantes Conexant Systems 
Logotipo Conexant Systems Logotipo



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No Preview Available ! CX77301 Hoja de datos, Descripción, Manual

Preliminary Information
This document contains information on a new product. The parametric information, although not
mfully characterized, is the result of testing initial devices.
CPAXM7tao7dSuh3lee0efot14rUD.ucoal-band EGSM900 / DCS1800 / GPRSThe CX77301 is a dual-band Power Amplifier Module (PAM) designed in a
compact form factor for Class 4 EGSM900 and Class 1 DCS1800 operation that
aalso supports multi-slot transmission for Class 10 General Packet Radio Service
.D(GPRS) operation.
wThe module consists of an EGSM900 PA block, a DCS1800 PA block, impedance
w matching circuitry for 50 input and output impedances, and bias control
w circuitry. Two separate Heterojunction Bipolar Transistor (HBT) PA blocks are
mfabricated on a single Gallium Arsenide (GaAs) die. One PA block operates in the
EGSM900 band and the other PA block supports the DCS1800 band. Optimized
ofor lithium ion battery operation, both PA blocks share common power supply
.cpins to distribute current. A custom CMOS integrated circuit provides the
internal interface circuitry, including a current amplifier that minimizes the
required power control current (IAPC) to 10 µA, typical. The GaAs die, the
USilicon (Si) die, and passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold.
t4The RF input and output ports are internally matched to 50 to reduce the
number of external components for a dual-band design. Extremely low leakage
ecurrent (2 µA, typical) of the dual PA module maximizes handset standby time.
eThe CX77301 also contains band-select switching circuitry to select EGSM
(logic 0) or DCS (logic 1) as determined from the Band Select (BS) signal. In the
hFunctional Block Diagram shown below, the BS pin selects the PA output
(DCS OUT or EGSM OUT) while the Analog Power Control (APC) controls the
Slevel of output power.
Distinguishing Features
• High efficiency:
EGSM 55%
DCS 50%
• Input/output matching
50 internal
• Small outline
9.1 mm x 11.6 mm
• Low profile
1.5 mm maximum
• Low APC current
10 µA typical
• Gold plated, lead-free contacts.
Applications
• Dual-band cellular handsets
encompassing
Class 4 EGSM900,
Class 1 DCS1800, and
up to Class 10 GPRS multi-slot
operation.
taFunctional Block Diagram
www.Da omDCSIN
U.cPower Control
t4Band Select
heeEGSM IN
Match
CMOS
Bias
Controller
Match
www.DataSData Sheet
VCC
HBT
Match
Match
DCS OUT
EGSM OUT
100956D
© 2001, Conexant Systems, Inc., All Rights Reserved.
January 2, 2002

1 page




CX77301 pdf
CX77301
PA Module for Dual-band EGSM900 / DCS1800 / GPRS
Electrical Specifications
Table 3. CX77301 Electrical Specifications (3 of 4)(1)
Parameter
Symbol
Test Condition
2nd to 7th Harmonics
Output Power
Input VSWR
Forward Isolation
Switching Time
Spurious
2f0 to 7f0
POUT
POUT MAX
POUT MAX
ΓIN
POUT STANDBY
τRISE, τFALL
Spur
BW = 3 MHz
0 dBm POUT32 dBm
VCC = 3.5 V
VAPC 2.0 V
TCASE = +25 °C
VCC = 2.9 V
VAPC 2.6 V
TCASE = 20 °C to +100 °C
(See Table 2 for multi-slot)
PIN = 5 dBm
VCC = 4.8 V
VAPC 2.6 V
TCASE = 20 °C to +100 °C
(See Table 2 for multi-slot)
PIN = 5 dBm
POUT = 0 to 32 dBm, controlled by
VAPC
PIN = 10.5 dBm
VAPC = 0.3 V
Time from POUT = 10 dBm to
POUT = 0 dBm, τ ≈ 90%
Time from POUT = 10 dBm to
POUT = +20 dBm, τ ≈ 90%
Time from POUT = 10 dBm to
POUT = +31.5 dBm, τ ≈ 90%
All combinations of the following
parameters:
VAPC = Controlled(3)
PIN = min. to max.
VCC = 2.9 V to 4.8 V
Load VSWR = 8:1, all phase angles
Min Typical Max Units
— — –7 dBm
31.5 32.0
dBm
29.5 30.5
dBm
29.5 30.5
dBm
— — 2:1
— –40 35 dBm
10 12 µs
5
8 µs
2
5 µs
No parasitic
oscillation > 36 dBm
100956D
Jannuary 2, 2002
Conexant
4

5 Page





CX77301 arduino
CX77301
PA Module for Dual-band EGSM900 / DCS1800 / GPRS
Technical Information
Technical Information
CMOS Bias Controller Characteristics
The CMOS die within the PAM performs several functions that are important to the overall module
performance. Some of these functions must be considered for development of the power ramping
features in a 3GPP compliant transmitter power control loop1. Power ramping considerations will
be discussed later in this section.
The four main functions that will be described in this section are Standby Mode Control, Band
Select, Voltage Clamp, and Current Buffer. The functional block diagram is shown in Figure 6.
Figure 6. Functional Block Diagram
vodcs cpdcs
CComp
Band
Select
(pin16)
APC input
(pin14)
Supply
(pin6)
cpgsm vogsm
CComp
Combinational
Logic
Voltage Clamp
Bandgap
Reference
CMOS bias controller
DCS1800
bias out
Cbypass
RF
Isolation
ground
Cbypass
GSM900
bias out
RF
Isolation
Dual Band GaAs Power Amplifier Die
100956_01
1. Please refer to 3GPP TS 05.05, Digital Cellular Communications System (Phase 2+); Radio Transmission and Reception. All GSM
specifications are now the responsibility of 3GPP. The standards are available at http://www.3GPP.org/3G_specs/spec_titles.htm
100956D
Jannuary 2, 2002
Conexant
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