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PDF SI1499DH Data sheet ( Hoja de datos )

Número de pieza SI1499DH
Descripción P-Channel MOSFET
Fabricantes Vishay Siliconix 
Logotipo Vishay Siliconix Logotipo



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New Product
P-Channel 1.2-V (G-S) MOSFET
Si1499DH
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
rDS(on) (Ω)
0.078 at VGS = - 4.5 V
0.095 at VGS = - 2.5 V
- 8 0.115 at VGS = - 1.8 V
0.153 at VGS = - 1.5 V
0.424 at VGS = - 1.2 V
ID (A)c
- 1.6
- 1.6
- 1.6
- 1.6
- 1.6b
Qg (Typ)
10.5 nC
SOT-363
SC-70 (6-LEADS)
D1
D2
G3
6D
5D
4S
Marking Code
BI XX
Lot Traceability
and Date Code
Part #
Code
Top View
Ordering Information: Si1499DH-T1-E3 (Lead (Pb)-free)
FEATURES
• TrenchFET® Power MOSFET
• Ultra-Low On-Resistance
• RoHS Compliant
APPLICATIONS
• Load Switch for Portable Devices
- Guaranteed Operation at VGS = 1.2 V
Critical for Optimized Design and Longer
Battery Life
S
RoHS
COMPLIANT
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)a, b
TC = 70 °C
TA = 25 °C
ID
TA = 70 °C
Pulsed Drain Current (10 µs Pulse Width)
IDM
Continuous Source-Drain Diode Currenta, b
TC = 25 °C
TA = 25 °C
IS
TC = 25 °C
Maximum Power Dissipationa, b
TC = 70 °C
TA = 25 °C
PD
TA = 70 °C
Operating Junction and Storage Temperature Range
TJ, Tstg
Soldering Recommendations (Peak Temperature)c, d
Limit
-8
±5
-1.6c
- 1.6c
- 1.6a, b, c
- 1.6a, b, c
- 6.5c
- 1.6c
- 1.3a, b
2.78
1.78
2.5a, b
1a, b
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta, d
t 5 sec
Maximum Junction-to-Foot (Drain)
Steady State
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 5 sec.
c. Package limited.
d. Maximum under Steady State conditions is 125 °C/W.
Document Number: 73338
S-61963-Rev. C, 09-Oct-06
Symbol
RthJA
RthJF
Typical
60
34
Maximum
80
45
Unit
°C/W
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1

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SI1499DH pdf
TYPICAL CHARACTERISTICS 25 °C, unless noted
6
Si1499DH
Vishay Siliconix
5
4
3
Package Limited
2
1
0
0 25 50 75 100 125 150 175
TC - Case Temperature (°C)
Current Derating*
TYPICAL CHARACTERISTICS 25 °C, unless noted
2
*The power dissipation PD is based on TJ(max) = 175 °C, using junc-
tion-to-case thermal resistance, and is more useful in settling the
upper dissipation limit for cases where additional heatsinking is
used. It is used to determine the current rating, when this rating falls
below the package limit.
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
10 -4
2
Notes:
PDM
Single Pulse
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = °C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
100
600
1
Duty Cycle = 0.5
0.2
0.1
0.1 0.05
0.0.202
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
1
10
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?73338.
Document Number: 73338
S-61963-Rev. C, 09-Oct-06
www.vishay.com
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