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PDF HSDL-3000 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-3000 | |
| Descripción | Irda 1.3 Data Compliant 115.2kb/s 3-5V Infrared Transceiver | |
| Fabricantes | Agilent Technologies | |
| Logotipo |  |
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Agilent HSDL-3000 # 007/017
IrDA® Data Compliant 115.2 kbps
Infrared Transceiver
Data Sheet
Description
The HSDL-3000 is a small form
factor infrared (IR) transceiver
module that provides interface
between logic and IR signals for
through-air, serial, half-duplex IR
data link. The module is compliant
to IrDA Physical Layer Specifica-
tions 1.3 and is IEC 825-Class 1
eye safe.
The HSDL-3000 can be shut down
completely to achieve very low
power consumption. In the shut-
down mode, the PIN diode will be
inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for battery-operated
handheld products.
The HSDL-3000 has two front
packaging type options (HSDL-
3000#007/017). Both options have
an integrated shield that helps to
ensure low EMI emission and high
immunity to EMI field, thus
enhancing reliable performance.
Application Support Information
The Application Engineering
group is available to assist you
with the technical understanding
associated with HSDL-3000
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.www.DataSheet4U.com
Applications
• Data communication
– PDAs
– Notebooks
– Printers
• Mobile telecom
– Cellular phones
– Pagers
– Smart phones
• Digital imaging
– Digital cameras
– Photo-imaging printers
• Electronic wallet
• Medical and industry data
collection
Features
• Fully compliant to IrDA 1.3
specifications:
– 2.4 kbps to 115.2 kbps
– Excellent nose-to-nose operation
– Typical link distance > 1.5 m
• Guaranteed temperature
performance, –20 to 70 °C
– Critical parameters are
guaranteed over temperature and
supply voltages
• Low power consumption
– Low shutdown current
(10 nA typical)
– Complete shutdown for
TXD, RXD, and PIN diode
• Small module size
– 2.70 x 9.10 x 3.65 mm (HxWxD)
• Withstands >100 mVp-p power supply
ripple typically
• VCC supply 2.7 to 5.5 volts
• LED stuck-high protection
• IEC 825-Class 1 eye safe
• Designed to accommodate light loss
with cosmetic windows
HSDL-3000 Ordering Information
Part Number
Packaging Type
HSDL-3000#007
Tape/Reel
HSDL-3000#017
Strip
Package
Front View
Front View
Quantity
2500
10
1 page  
Electrical & Optical Specifications (Continued)
Parameter
Symbol Min. Typ. Max. Units Conditions
Transceiver
Input Current
High
Low
Supply Current
Shutdown
Idle
Active
IH
0.01 1
µA VI ≥ VIH
IL
–1 -0.02 1
µA 0 ≤ VI ≤ VIL
ICC1
0.01 1
µA VSD ≥ VCC – 0.5, TA = 25°C
ICC2 290 450 µA VI(TXD) ≤ VIL, EI = 0
ICC3
28
mA VI(TXD) ≥ VIL
Notes:
1. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
2. For in-band signals 2.4 kbps to 115.2 kbps where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2.
3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity.
4. Receiver wake up time is measured from VCC power on to valid RXD output.
5. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse.
6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED.
500
2.2 Ω
470
2.7 Ω
440
410
6.8 Ω
380
350
320
290
2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7
VCC (V)
ILED vs. VCC.
500
470
www.DataSheet4U.com
440
410
380
350
320
290
1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20
VON (LEDA)
ILED vs. VON (LEDA).
110
100
90
80
70
60
50
40
1.80 220 260 300 340 380 420 460 500
ILED (mA)
IEH vs. ILED.
5
5 Page 
1.2 Adjacent Land Keep-out and Solder Mask Areas
Dim. mm
Inches
h min. 0.40 min. 0.016
j 10.1 0.40
k 3.85 0.15
l 3.2 0.126
Rx LENS
j
Tx LENS
• Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no
other SMD components within
this area.
• “h” is the minimum solder
resist strip width required to
avoid solder bridging adjacent
pads.
LAND
h
Y
SOLDER
MASK
k
X
l
• It is recommended that 2
fiducial cross be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask.
www.DataSheet4U.com
2.0 Recommended Solder Paste/
Cream Volume for Castellation
Joints
The recommended printed solder
paste volume required per
castellation pad is 0.30 cubic mm
(based on either no-clean or
aqueous solder cream types with
typically 60 to 65% solid content
by volume).
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet HSDL-3000.PDF ] | |
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