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PDF MAAPGM0026-DIE Data sheet ( Hoja de datos )
| Número de pieza | MAAPGM0026-DIE | |
| Descripción | Amplifier | |
| Fabricantes | Tyco Electronics | |
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Amplifier, Power, 0.6W
1.5-3.3 GHz
Features
♦ 0.6 Watt Saturated Output Power Level
♦ Variable Drain Voltage (4-10V) Operation
♦ MSAG™ Process
MAAPGM0026-DIE
903185 —
Preliminary Information
Description
The MAAPGM0026-DIE is a 2-stage, 0.6 W power amplifier with
on-chip bias networks. This product is fully matched to 50 ohms
on both the input and output. It can be used as a power amplifier
stage or as a driver stage in high power applications.
Fabricated using M/A-COM’s repeatable, high performance and
highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™)
Process, each device is 100% RF tested on wafer to ensure
performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manu-
facturing processes, planar processing of ion implanted transis-
tors, multiple implant capability enabling power, low-noise, switch
and digital FETs on a single chip, and polyimide scratch protec-
tion for ease of use with automated manufacturing processes.
The use of refractory metals and the absence of platinum in the
gate metal formulation prevents hydrogen poisoning when em-
ployed in hermetic packaging.
Primary Applications
♦ 2.5-2.7 GHz MMDS
♦ GPS
♦ WLAN
♦ Point-to-Multipoint Radios
Electrical Characteristics: TB = 40°C1, Z0 = 50 Ω, VDD = 8V, VGG = -2V, Pin = 12 dBm
Parameter
Symbol
Typical
Units
Bandwidth
f
1.5-3.3
GHz
Output Power
POUT
28
dBm
Power Added Efficiency
PAE
25
%
1-dB Compression Point
Small Signal Gain
Input VSWR
Gate Current
Drain Current
Output Third Order Intercept
P1dB
G
VSWR
IGG
IDD
OTOI
27
20
1.7:1
< 10
< 300
36
dBm
dB
mA
mA
dBm
Noise Figure
NF
6
dB
3rd Order Intermodulation Distortion
IM3
31
dBc
Single Carrier Level = 23 dBm
5th Order Intermodulation Distortion
IM5
41
dBc
Single Carrier Level = 23 dBm
2nd Harmonic 2f -15 dBc
3rd Harmonic
3f -25 dBc
1. TB = MMIC Base Temperature
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page  
Amplifier, Power, 0.6W
1.5-3.3 GHz
Assembly and Bonding Diagram
MAAPGM0026-DIE
903185 —
Preliminary Information
100 pF
0.1 μF
VDD
RFIN
RFOUT
VGG
100 pF
0.1 μF
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW test-
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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