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PDF CM1206 Data sheet ( Hoja de datos )
| Número de pieza | CM1206 | |
| Descripción | ESD Protection Arrays Chip Scale Package | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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CM1206www.DataSheet4U.com
ESD Protection Arrays, Chip Scale Package
Features
• Functionally and pin compatible with CMD’s
PACDN2404C/08C/16C family of devices
• OptiGuard™ coated for improved reliability at
assembly
• 4, 8, or 16 transient voltage suppressors in a single
package
• In-system Electrostatic Discharge (ESD) protection
to +18kV contact discharge per IEC 61000-4-2
international standard
• Supports AC signal applications
• Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
• Lead-free versions available
Applications
• ESD protection for sensitive electronic equipment
• I/O port, keypad and button circuitry protection for
portable devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Cameras and Camcorders
• Notebooks
• Desktop PCs
Product Description
The CM1206 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD. The back-to-back Zener connections provide
ESD protection in cases where nodes with AC signals
are present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard. All I/Os are rated at +18kV
using the IEC 61000-4-2 contact discharge method.
Using the MIL-STD-883D (Method 3015) specification
for Human Body Model (HBM) ESD, all pins are pro-
tected for contact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1206 incorporates OptiGuard™ coating which
results in improved reliability at assembly. The CM1206
is also available with optional lead-free finishing.
Electrical Schematic
B1 B2 B3
B1 B2 B3 B4 B5
D1 D2 D3 D4 D5
A1 A2 A3
CM1206-04CS/CP
A1 A2 A3 A4 A5
CM1206-08CS/CP
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
CM1206-16CS/CP
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
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CM1206www.DataSheet4U.com
Mechanical Details
The CM1206 devices are packaged in custom Chip
Scale Packages (CSP).
CM1206-04 6-bump CSP Mechanical Specifications
The CM1206-04 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 1.759 1.804 1.849 0.0693 0.0710 0.0728
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
B3 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.638 0.707 0.776 0.0251 0.0278 0.0306
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuardTM
Coating
3
2
1
BA
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1206-04 6-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1206-04
CHIP SIZE (mm)
1.804 X 1.154 X 0.707
POCKET SIZE (mm)
B0 X A0 X K0
1.98 X 1.32 X 0.91
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches Cumulative
±To0l.e2ramnmce On Tape
W
QTY
PER
REEL
3500
P0 P1
4mm 4mm
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CM1206.PDF ] | |
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