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PDF CM1414 Data sheet ( Hoja de datos )
| Número de pieza | CM1414 | |
| Descripción | 2 Channel Headset EMI Filter with ESD Protection | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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CM1414www.DataSheet4U.com
2 Channel Headset EMI Filter with ESD Protection
Features
• Functionally and pin compatible with CMD’s
CSPEMI204
• OptiGuard™ coated for improved reliability at
assembly
• Two channels of EMI filtering, one for a micro-
phone and one for an earpiece speaker
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Greater than 35dB attenuation in the 800-
2700MHz range
• +8kV ESD protection on each channel (IEC 61000-
4-2 Level 4, contact discharge)
• +15kV ESD protection on each channel (HBM)
• Chip Scale Package features extremely low para-
sitic inductance for optimum filter performance
• 5-bump, 0.950mm X 1.41mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset micro-
phone and earpiece speaker ports
• Cellular / Mobile Phones
• Notebooks and Personal Computers
• Handheld PCs / PDAs / Tablets
• Wireless Handsets
• Digital Camcorders
Product Description
The CM1414 is a low-pass filter array designed specifi-
cally to reduce EMI/RFI emissions and provide ESD
protection for a headset port on a cellular and mobile
devices. The CM1414 integrates two high quality, pi-
style filters (C-R-C) filters, one for a microphone and
one for an earpiece or speaker, each providing more
than 35dB attenuation relative to the pass band attenu-
ation in the 800-2700 MHz range. These filters support
bidirectional filtering, reducing EMI both to and from
the headset port and support bipolar audio signals
without distortion.
In addition, the CM1414 provides a very high level of
protection for sensitive electronic components that may
be subject to electrostatic discharge (ESD). The input
pins are designed and characterized to safely dissipate
ESD strikes of +8kV contact discharge, the maximum
requirement of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater
than +15kV. The CM1414 protects sensitive compo-
nents such as CPU and DSPs that have much weaker
internal ESD protection circuitry usually only intended
for mechanical handling protection.
The CM1414 is particularly well suited for portable
electronics because of its small package format and
low weight. The CM1414 incorporates OptiGuard™
coating which results in improved reliability at assem-
bly and is available in a space-saving, low-profile Chip
Scale Package with optional lead-free finishing.
Electrical Schematic
EAR_IN A1
10 Ω
C1 EAR_OUT
MIC_IN A3
68 Ω
C3 MIC_OUT
GND B2
© 2005 California Micro Devices Corp. All rights reserved.
11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
1
1 page  
CM1414www.DataSheet4U.com
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
VALUE
0.275mm Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50μm
+20μm
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CM1414.PDF ] | |
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