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PDF CM1442 Data sheet ( Hoja de datos )

Número de pieza CM1442
Descripción LCD and Camera EMI Filter Array
Fabricantes California Micro Devices 
Logotipo California Micro Devices Logotipo



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CM1442
LCD and Camera EMI Filter Array with ESD Protection
Features
• Six and eight channels of EMI filtering with inte-
grated ESD protection
• 0.4mm pitch, 15-bump, 2.360mm x 1.053mm foot-
print Chip Scale Package (CM1442-06)
• 0.4mm pitch, 20-bump, 3.160mm x 1.053mm foot-
print Chip Scale Package (CM1442-08)
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
• Greater than 30dB attenuation (typical) at 1 GHz
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
OptiGuardcoated for improved reliability at
assembly
• Lead-free version available
Applications
• LCD and Camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs etc.
• EMI filtering for data ports in cell phones, PDAs or
notebook computers.
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1442 is a family of pi-style EMI filter arrays with
ESD protection, which integrates six and eight filters
(C-R-C) in Chip Scale Package form factor with
0.40mm pitch. The CM1442 has component values of
15pF-100Ω-15pF per channel. The CM1442 has a cut-
off frequency of 120MHz and can be used in applica-
tions where the data rates are as high as 48Mbps. The
parts include avalanche-type ESD diodes on every pin,
which provide a very high level of protection for sensi-
tive electronic components that may be subjected to
electrostatic discharge (ESD). The ESD protection
diodes safely dissipate ESD strikes of ±15kV, well
beyond the maximum requirement of the IEC61000-4-
2 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact dis-
charges at greater than ±30kV.
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CM1442 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
The CM1442 incorporates OptiGuardwhich results
in improved reliability at assembly. The CM1442 is
available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing. It is manu-
factured with a 0.40mm pitch and 0.25mm CSP solder
ball to provide up to 28% board space saving versus
competing CSP devices with 0.50mm pitch and
0.30mm CSP solder ball.
Electrical Schematic
FILTER+ESDn*
(Pins A1-An)
100Ω
15pF
15pF
FILTER+ESDn*
(Pins C1-Cn)
GND
(Pins B1-Bm
where m = n/2)
* See Package/Pinout Diagram
for expanded pin information.
1 of 6 or 8 EMI/RFI + ESD Channels
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com
1

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CM1442 pdf
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
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CM1442
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com
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CM1442 arduino
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CM1442
Mechanical Details (cont’d)
CM1442-08 Mechanical Specifications
The package dimensions for the CM1442-08 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim Min Nom Max Min Nom Max
A1 3.115 3.160 3.205 0.1226 0.1244 0.1262
A2 1.008 1.053 1.098 0.0397 0.0415 0.0432
B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159
B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080
B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091
C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1 B2
B1
C
B
AA
1234567 8
0.25 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuardTM
Coating
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1442-08 Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER CHIP SIZE (mm)
CM1442-08 3.16 X 1.053 X 0.644
POCKET SIZE (mm)
B0 X A0 X K0
3.28 X 1.32 X 0.81
TAPE
WIDTH W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P0 P1
4mm 4mm
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches Cumulative
±To0l.e2ramnmce On Tape
W
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P1
User Direction of Feed
Center Lines
of Cavity
Figure 14. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com
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