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PDF CM1452 Data sheet ( Hoja de datos )

Número de pieza CM1452
Descripción LCD and Camera EMI Filter Array
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! CM1452 Hoja de datos, Descripción, Manual

LCD and Camera EMI Filter Arraywww.DataSheet4U.com
with ESD Protection
CM1452
Features
• Four, six and eight channels of EMI filtering with
integrated ESD protection
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
• Greater than 30dB attenuation (typical) at 1 GHz
• Chip Scale Package (CSP) with 0.40mm pitch
and 0.25mm CSP solder ball which features
extremely low parasitic inductance for optimum
filter and ESD performance
OptiGuardTM Coating for improved reliability at
assembly
• RoHS-compliant, lead-free finishing
Applications
• LCD and Camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs etc.
• EMI filtering for data ports in cell phones, PDAs
or notebook computers.
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1452 family of pi-style EMI filter arrays with
ESD protection, integrates four, six and eight filters
(C-L-C) in CSP form factor with 0.40mm pitch. Each
EMI filter channel of the CM1452 is implemented as a
3-pole L-C filter where the component values are
20pF-17nH-20pF. The CM1452 roll-off frequency at -
6dB attenuation is 330MHz and can be used in
applications where the data rates are as high as
132Mbps and provide greater than 30dB over the
800MHz to 2.7GHz frequency range. The ESD
diodes on every I/O pin provide a very high level of
ESD protection for sensitive electronic components.
The ESD protection diodes connected to the filter
ports are designed and characterized to safely
dissipate ESD strikes of ±15kV, beyond the
maximum requirement of the IEC61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact
discharges at greater than ±30kV.
The CM1452 incorporates OptiGuardTM which results
in improved reliability at assembly. The CM1452 is
manufactured with a 0.40mm pitch and 0.25mm CSP
solder ball to provide up to 28% board space savings
vs. competing CSP devices with 0.50mm pitch and
0.30mm CSP solder ball.
Electrical Schematic
m
. . . .L
A1 - An
C1 - Cn
C1 C1
. .B1 - Bn
..
CM1452 schematic diagram of 3-pole L-C filter array with ESD.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1452/D

1 page




CM1452 pdf
CM1452
www.DataSheet4U.com
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER
LCHAN Channel Inductance
C Total Channel Capacitance at
TOT
2.5Vdc; 1MHz, 30mVac
CONDITIONS
2.5V dc; 1MHz, 30mV ac
C1 Capacitance C1 at 2.5V dc; 1MHz, 2.5V dc; 1MHz, 30mV ac
30mV ac
fC Cut-off Frequency, ZSOURCE =
50Ω, ZLOAD = 50Ω
f Roll-off Frequency at -6dB
R
Attenuation, ZSOURCE = 50Ω,
ZLOAD = 50Ω
V Stand-off Voltage, I = 10mA
ST
I Diode Leakage at 3.3V reverse bias
LEAK
voltage
V Signal Clamp Voltage:
SIG
Positive Clamp
Negative Clamp
I = 10mA
LOAD
I = -10mA
LOAD
VESD In-system ESD withstand voltage*: Notes 2 and 3
a) Human Body Model, MIL-STD-
883, Method 3015
b) Contact Discharge per IEC
61000-4-2 Level 4
RDYN Dynamic Resistance
Channel Positive Transients
Channel Negative Transients
AL Current per Inductor:
DC DC Package Power Rating:
MIN TYP MAX UNITS
17 nH
24 30 36 pF
15 pF
148 MHz
330 MHz
5.5 V
0.1 1.0
µA
5.6
6.8 9.0
V
-1.5
-0.8 -0.4
V
±30 kV
±15 kV
2.3
0.9
30
30
Ω
Ω
mA
W
Note 1: All parameters specified at TA = –40°C to +85°C unless otherwise noted.
Note 2: ESD applied to input/output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side
of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1).
Note 3: Unused pins are left open.
Rev. 2 | Page 5 of 16 | www.onsemi.com

5 Page





CM1452 arduino
CM1452
www.DataSheet4U.com
Mechanical Specifications
CM1452-04CP devices are packaged in custom Chip Scale Packages (CSP).
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
10
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 1.627 1.672 1.717 0.0641 0.0658 0.0676
A2 1.068 1.113 1.158 0.0420 0.0438 0.0456
B1 0.395 0.400 0.405 0.0156 0.0157 0.0159
B2 0.195 0.200 0.205 0.0077 0.0079 0.0081
B3 0.342 0.347 0.352 0.0135 0.0137 0.0139
B4 0.342 0.347 0.352 0.0135 0.0137 0.0139
C1 0.186 0.236 0.286 0.0073 0.0093 0.0113
C2 0.160 0.210 0.260 0.0063 0.0082 0.0102
D1 0.545 0.615 0.685 0.0215 0.0242 0.0270
D2 0.378 0.419 0.460 0.0149 0.0165 0.0181
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1452-04CP Chip Scale Package
Rev. 2 | Page 11 of 16 | www.onsemi.com

11 Page







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