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PDF CM6100 Data sheet ( Hoja de datos )
| Número de pieza | CM6100 | |
| Descripción | 0.4mm Pitch Daisy Chain | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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0.4mm Pitch Daisy Chain
CM6100
Product Description
The 6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully
compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant.
Electrical Schematic / Pin Description
A = ww01, ww02
B = ww03, ww04
C = ww05, ww06
D = ww06, ww08
E = ww08, ww10
F = ww11, ww12
G = ww13, ww14
H = ww15, ww16
I = ww17, ww18
WHERE X =
J = ww19, ww20
K = ww21, ww22
L = ww23, ww24
M = ww25, ww26
N = ww27, ww28
O = ww29, ww30
P = ww31, ww32
Q = ww33, ww34
R = ww35, ww36
S = ww37, ww38
T = ww39, ww40
U = ww41, ww42
V = ww43, ww44
W = ww45, ww46
X = ww47, ww48
Y = ww49, ww50
Z = ww51, ww52
©2010 SCILLC. All rights reserved.
May 2010 Rev. 6
Publication Order Number:
CM6100/D
1 page  
CM6100
Vertical Structure Specification*
Figure 1. Sectional View
* Daisy Chain CM6000
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Vertical Structure Dimensions (nominal)
REF.
Parameter
a Die Thickness
Material
Silicon
Dimension
396μm
h Repassivation
Polyimide
10μm
UBM-(Ti/Cu)
Plated Cu
5.0μm
d Sputtered Cu 0.4μm
Sputtered Ti 0.1μm
UBM Wetting Area
e Diameter
240μm
b Bump Standoff
194μm
Solder Bump
f Diameter after
Bump Reflow
270μm
c Metal Pad Height
AlSiCu
1.5μm
g Metal Pad Diameter
310μm
D2 0.406mm
D1 Finished Thickness
0.600mm
Rev. 6 | Page 5 of 6 | www.onsemi.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CM6100.PDF ] | |
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