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PDF SI8251 Data sheet ( Hoja de datos )
| Número de pieza | SI8251 | |
| Descripción | (SI8250 - SI8252) DIGITAL POWER CONTROLLER | |
| Fabricantes | Silicon Laboratories | |
| Logotipo |  |
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Si8250/1/2
DIGITAL POWER CONTROLLER
Features
Single-chip, Flash-based digital
power controller
Supports isolated and non-isolated
applications
Enables new system capabilities
such as:
- Adaptive dead-time control for
higher efficiency
- Nonlinear control for faster
transient response
- Self diagnostics for higher
reliability
- SMBus port
Highly-integrated control solution:
High-speed digital hardware
control loop
In-system programmable
supervisory processor
Programmable system protection
functions
Hardware cycle-by-cycle current
limiting and OCP
External clock and frame
synchronization inputs
Performs system management
functions, such as external power
supply sequencing and fan
control/monitoring
In-system Flash programmable
Flash can also be used as NV
memory for data storage
Low-cost, comprehensive
development tool kit includes:
Graphical, easy-to-use system
design tools
Integrated development
environment
In-system, on-line debugger
Turnkey isolated 35 W digital
half-bridge target board
Typical Applications
Isolated and non-isolated DC/DC
converters
AC/DC converters
Fully Pb-free and ROHS compliant
packages
32-pin LQFP
28-pin 5x5 mm QFN
Temp Range: –40 to +125 °C
Description
The Si8250/1/2 provides all control and protection functions necessary to
implement highly-intelligent, fast-response power delivery and
management control systems for isolated and non-isolated power
supplies. Onboard processing capability enables intelligent control
optimization for improved system performance and new capabilities, such
as serial connectivity via the SMBus or onboard UART. The Si8250/1/2
family is in-system Flash programmable, enabling control and protection
parameters, such as system regulation and protection settings, startup
and shutdown modes, loop response, and modulation timing, to be readily
modified. The built-in, high-speed control path provides loop updates
every 100 ns and provides pulse-by-pulse current limiting and overcurrent
protection, even while the internal CPU is disabled.
The Si825x family is supported by the Si8250DK development kit, which
contains everything required to develop and program power supply
applications with the Si825x family of digital controllers.
Pin Assignments:
See page 23
32-pin LQFP
RST/C2CK
IPK
VSENSE
1
2
3
GNDA 4
VDDA 5
VREF 6
P1.0/VIN/AIN0 7
P1.1/AIN1 8
Si8250/1/2
Top View
24 P0.0
23 P0.1
22 P0.2
21 P0.3 / XCLK
20 P0.4
19 P0.5
18 P0.6
17 P0.7
28-pin QFN
GND
RST / C2CK 1
IPK 2
VSENSE 3
GND 4
VDD 5
VREF 6
P1.0/VIN/AIN0 7
Si8250/1/2
Top View
GND
21 P0.1
20 P0.2
19 P0.3/XCLK
18 P0.4
17 P0.5
16 P0.6
15 P0.7
Patents pending
Rev. 1.0 6/07
Copyright © 2007 by Silicon Laboratories
Si8250/1/2
1 page  
Si8250/1/2
Table 3. Reference DAC Electrical Specifications
TA = –40 to +125 °C, VDD = 2.5 V, SYSCLK = 25 MHz, PLLCLK = 200 MHz unless otherwise specified.
Parameter
Conditions
Min Typ Max
Resolution
——
9
LSB size
— 2.44 —
Integral nonlinearity (INL)
–2 — +2
Differential nonlinearity (DNL)
–1.0 — +1.0
Settling time
1/2 LSB change from
—
2
—
0 to full scale
Turn-on time
— 20 —
Noise
2 MHz BW
—1—
Power supply rejection
— 70 —
Supply current
— 220 —
Shutdown supply current
— 0.1 —
Units
Bits
mV
LSB
LSB
µs
µs
mVPP
db
µA
µA
Rev. 1.0
5
5 Page 
Si8250/1/2
Table 11. Reset Electrical Characteristics
TA = –40 to +125 °C, VDD = 2.5 V, SYSCLK = 25 MHz, PLLCLK = 200 MHz unless otherwise specified.
Parameter
Conditions
Min Typ Max
RST output low voltage
IOL = 8.5 mA, VDD = 2.5 V — — 0.7
RST input high voltage
RST input low voltage
RST input pull-up current
RST = 0.0
0.7 x VDD
—
—
— — 0.3 x VDD
— 25 45
VDD POR threshold
2.0 2.1 2.2
Missing clock detector timeout
Time from last system clock
rising edge to start of reset
—
250 650
Reset time delay
Delay between release of any
reset source and code execu-
tion at location 0x0000
5.0
—
—
Minimum RST low time to gen-
erate a System Reset
VDD monitor turn-on time
VDD monitor supply current
6.5 —
100 —
— 40
—
—
—
Units
V
V
V
µA
V
µs
µs
µs
µs
µA
Table 12. Flash Electrical Characteristics
TA = –40 to +125 °C, VDD = 2.25 to 2.75 V, SYSCLK = 25 MHz, PLLCLK = 200 MHz unless otherwise specified.
Parameter
Flash size
Conditions
Si8250
Si8251, Si8252
Min
32768*
16384*
Typ
—
—
Max
—
—
Units
bytes
Endurance
10 k 100 k — Erase/Write
Read cycle time
40 — —
ns
Erase cycle time
50 MHz system clock
32 — 48
ms
Write cycle time
50 MHz system clock
76 — 114
µs
*Note: The last 512 bytes of memory are reserved.
Rev. 1.0
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet SI8251.PDF ] | |
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