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PDF MPXHZ6117AC6T1 Data sheet ( Hoja de datos )
| Número de pieza | MPXHZ6117AC6T1 | |
| Descripción | Media Resistant Integrated Silicon Pressure Sensor | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Freescale Semiconductor
Pressure
MPXHZ6117A
Rev 0, 03/2010
Media Resistant Integrated Silicon
Pressure Sensor for Measuring
Absolute Pressure, On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
MPXHZ6117A
Series
10 to 115 kPa (14.5 to 16.7 psi)
0.4 to 4.653 V Output
The MPXHZ6117A series pressure sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal
and temperature compensation. The sensor’s packaging has been designed
to provide resistance to high humidity conditions as well as common
automotive media. The small form factor and high reliability of on-chip
integration make this sensor a logical and economical choice for the system
designer.
The MPXHZ6117A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
Features
• Resistant to High Humidity and Common Automotive Media
• Improved Accuracy at High Temperature
• 1.5% Maximum Error over 0°C to 85°C
• Temperature Compensated from -40°C to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port
• Ideally Suited for Microprocessor or Microcontroller Based Systems
ORDERING INFORMATION
Device Name
Package
Options
Case
No.
# of Ports
None Single Dual
Super Small Outline Package (Media Resistant Gel) (MPXHZ6117A Series)
Pressure Type
Gauge Differential Absolute
MPXHZ6117A6U
Rail
1317
•
•
MPXHZ6117A6T1
Tape & Reel
1317
•
•
MPXHZ6117AC6U
Rail 1317A
•
•
MPXHZ6117AC6T1 Tape & Reel 1317A
•
•
Device Marking
MPXHZ6117A
MPXHZ6117A
MPXHZ6117A
MPXHZ6117A
SUPER SMALL OUTLINE PACKAGE
MPXHX6117A6U/6T1
CASE 1317
MPXHX6117AC6U/6T1
CASE 1317A
© Freescale Semiconductor, Inc., 2010. All rights reserved.
1 page  
Pressure
Temperature Error Band
MPXHZ6117A Series
Temperature
Error
Factor
4.0
3.0
2.0
1.0
Break Points
Temp
-40
0 to 85
125
Multiplier
3
1
1.75
0.0
-40 -20 0 20 40 60 80 100 120 140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Pressure Error Band
3.0
2.0
Error Limits for Pressure
1.0
0.0 Pressure (in kPa)
20 40 60 80 100 120
-1.0
-2.0
Pressure
Error (Max)
-3.0 10 to 115 (kPa) ±1.5 (kPa)
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.150
3.81
0.050
1.27
TYP
0.387
9.83
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
Sensors
Freescale Semiconductor
Preliminary
MPXHZ6117A
5
5 Page 
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Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
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All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2010. All rights reserved.
MPXHZ6117A
Rev. 0
03/2010
11 Page | ||
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