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PDF TS31223 Data sheet ( Hoja de datos )
| Número de pieza | TS31223 | |
| Descripción | High Input Voltage Linear Regulator | |
| Fabricantes | Semtech | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TS31223 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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TRIUNE PRODUCTS
Features
• Wide input supply operating range
TS31023 : 5V-16V
TS31223 : 5V-36V
• Adjustable output voltage from 1.25V to VIN - Vdropout
• 60mA output current capability
• Enable control function
Applications
• Set-top Boxes
• Automotive
• Industrial
• Medical
• Energy harvesting systems
• Wireless Power
TS31023/223
High Input Voltage
Linear Regulator
Description
The TS31x23 high voltage linear regulator consists of a low
power amplifier with a high voltage p-channel pass gate.
The linear regulator has a wide operating range, and is ideal
for systems that may have large voltage transients and require
the output load to remain regulated.
An analog current limit is used to limit output current and
protect the regulator from external short circuits.
Summary Specification
• Ambient operating temperature 0C to 85C
• Packaged in a 8pin DFN (2x2)
Typical Application Circuit
TS31023/223
Final Datasheet
March 19, 2015
Rev 1.1
www.semtech.com
1 of 15
Semtech
Proprietary & Confidential
1 page  
Typical Performance Characteristics continued
TS31023/223
Final Datasheet
March 19, 2015
Rev 1.1
www.semtech.com
5 of 15
Semtech
Proprietary & Confidential
5 Page 
Table 4-1 SnPb Eutectic Process - Package Peak Reflow Temperatures
Package Thickness
< 2.5mm
> 2.5mm
Volume mm3 < 350
240 +0/-5 OC
225 +0/-5 OC
Volume mm3 > 350
225 +0/-5 OC
225 +0/-5 OC
Table 4-2 Pb-free Process - Package Peak Reflow Temperatures
Package Thickness
Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000
< 1.6mm
260 OC*
260 OC*
260 OC*
1.6mm - 2.5mm
260 OC*
250 OC*
245 OC*
> 2.5mm
250 OC*
245 OC*
245 OC*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classified temperature at the rated MSL level
Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks.
Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduc-
es
the thermal gradients between packages. However, thermal gradients due to differences in thermal mas of SMD packages may still exist.
Note 3: Components intended for use in a “lead-free” assembly process shall be evaluated using the “lead-free” peak temperature and profiles defined in
Tables 4-1, 4.2 and 5-2 whether or not lead free.
TS31023/223
Final Datasheet
March 19, 2015
Rev 1.1
www.semtech.com
11 of 15
Semtech
Proprietary & Confidential
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet TS31223.PDF ] | |
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