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Datasheet CPT-375-1 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | Category |
1 | CPT-375-1 | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection | Component General | data |
2 | CPT-375-1B | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection | Component General | data |
CPT Datasheet ( Hoja de datos ) - resultados coincidentes |
N.º | Número de pieza | Descripción | Fabricantes | Catagory |
1 | CPT-100-2 | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection Component General data | | |
2 | CPT-100-2B | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection Component General data | | |
3 | CPT-1000-1* | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection Component General data | | |
4 | CPT-182 | Surface Mountable Chip Photo-transistor CPT-182 Series Position of die
(1.2) 2.4
Resin
Soldering terminal C
2.2 (0.5)
(1.8)
3.2
(2.6)
Polarity E Emitter mark
(0.3)
(2.1) 2.4
P.C.board
0.5
Special EfficiencyCharacteristics
100 80 60 10000
VCE=3V Ta=25˚C
Characteristics
700 600
Ic-VCE Characteristics
Ta=25˚C 175 0.5mW/cm2 150 0.4 VCE=5V
C ETC transistor | | |
5 | CPT-184 | Surface Mountable Chip Photo-transistor CPT-184 Series m o .c U 4 t e e h S a at .D w w w
Position of die
2.4
(0.3)
(1.2)
Special EfficiencyCharacteristics
100 80 60
Relative efficiency
Ic (µA)
Ic (µA)
1000
400
0.3 0.2 0.1
(dB)
m o .c U 4 t e e h S a t a .D w w w
Resin Soldering terminal C
2.2 (0.5)
3.2
(1.8)
(2.6)
Polarity
0.5
E
ETC transistor | | |
6 | CPT-230 | Surface Mountable Chip Photo-transistor CPT-230 Series Position of die
(0.5) 1.6
Resin
Soldering terminal
2.2 (0.5)
(1.7) 3.2
C
(0.9) (1.4)
Polarity E Emitter mark
0.3 1.1
0.5
P.C.board
Special EfficiencyCharacteristics
100
10000
VCE=3V Ta=25˚C
Characteristics
Ic-VCE Characteristics
Ta=25˚C
Characteristics
175
VCE=5V
Frequency response
ETC transistor | | |
7 | CPT-230-1 | Surface Mount Terminations __ Stripline Chip Terminations
_ MECHANICAL SPECIFICATIONS
Substrate : Resistive Element : Terminals :
Beryllium Oxide Ceramic. Proprietary Thick Film. Proprietary Silver. ± .005" Except where noted (*), then ± .010"
Tolerance :
high power chip Terminations product selection Component General data | |
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Número de pieza | Descripción | Fabricantes | |
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